YCS Mobile BGA Reballing Stencils for iPhone Android Phones CPU Chip Chips & Components Embedded with Book original design

Embedded with Book original design

Easy UFS EMMC UFS ISP kit: including encryption chip

AY A108 iPhone X/11/12/13/14/15/16 Pro Max Dot Matrix No-soldering Non-disassembly Face ID Repair Tag-on Cable Solution

Break revolution close rotate

Mechanic D65T features:

YCS Mobile BGA Reballing Stencils for iPhone Android Phones CPU Chip Chips & Components Embedded with Book original designYCS Chip Repair Soldering Stencil is made of imported alloy steel, possessing superior flexibility and high temperature resistance. It ensures precise mesh alignment and long term durability, making it suitable for BGA soldering repair of mobile phone chips, especially for soldering CPUs and GPUs in Apple iPhone 6 17 Pro Max and Android Phone series. Features: 1. High Precision: Each mesh is calibrated according to the original manufacturer's