SKU: 32829527431
Ships within 48 hours · Estimated delivery Sep 13 - Sep 18
E-Mate X EMMC BGA - Compatible Boxes:
In System Programming (ISP) now possible for MMC and UFS flash memory types
Sensor: Sony CMOS sensor
Length adjustment: Fix the grinding moving length by adjusting the stop block
upper and lower sponge cushion protection design
HMT-X1 Motherboard Layering Chip Glue Removal Heating Table Voltage:110V E-Mate X EMMC BGA -HMT X1 ZJ X1 multi functional motherboard layered chip glue removal heating table for iPhone 16 15 14 13 12 11 X PCB layering tinning repair and chip glue removal. HMT X1 360W universal motherboard delamination and degumming heating table for mobile phone motherboard repair. Features: 1. Temperature control imported from Germany, rapid heating. 2. Turn on the chip degumming station temperature switch, the chip degumming station starts to heat up. 3.
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