SKU: 31513312744
Ships within 48 hours · Estimated delivery Sep 12 - Sep 17
BGA315 Nand Module: For iPhone 14/14Plus/14 Pro/ 14 Pro Max/15/15Plus/15 Pro/15 Pro Max/SE3
and 7 interfaces can be used simultaneously
Global shutter
Wooden case size: 45*34*56cm
Engraving knife x3
YCS 2S Chip Heating Platform for Phone CPU IC Glue Removal Face ID Test Tool BGA315 Nand Module: For iPhoneYCS 2S Chip Heating Platform for mobile phone iPhone IC glue removal. MaAnt SL 2 CPU Chip Glue Heating Removal Station for Phone IC Chips Heating Degumming. YCS 2S CPU chip glue heating removal platform for iPhone repair. YCS mobile phone repair tool. Efficient preheating, a versatile soldering platform, and safe, efficient chip debonding. Option: 1. YCS 2S CPU chip glue heating removal platform it's been discontinued. 2. MaAnt SL 2 CPU Chip Glue
US$ 14.00
US$ 10.00
US$ 45.00
US$ 15.00
US$ 25.00
US$ 124.00
