MECHANIC Heat-Mini IC Glue Removal Station for Chips up to 18*21mm Clearance Items can be connected to mobile

can be connected to mobile phone and computer

ultra-precision cutting

Option 3: For iPhone X-11 pro max Pre-Heating groove

Sensor:16MP COMS

Large flat integrated circuit IC desoldering

MECHANIC Heat-Mini IC Glue Removal Station for Chips up to 18*21mm Clearance Items can be connected to mobileMECHANIC Heat Mini Heating Station for Mobile Phone CPU IC Glue Removal. Intelligent one click heating, adjustable from 160C to 250C. Easily removes adhesive glue with a brush without damaging the chip. The 18*21mm heating area is compatible with most mobile phone chips, Nand Flash, CPUs, and other tasks involving adhesive and solder removal. Features: 1. Employs a professional temperature control curve algorithm with a built in factory calibrated