XZZ L23 CPU Reballing Stencil Platform For iPhone A8-A16 BGA Repair Digital Multimeter Diopter adjustment: +/-5DP

Diopter adjustment: +/-5DP

support POE power supply (default does not support POE)

RELFIE RL-304P 6-Port

no rebound

Power supply: 2 * 1

XZZ L23 CPU Reballing Stencil Platform For iPhone A8-A16 BGA Repair Digital Multimeter Diopter adjustment: +/-5DPXZZ L23 CPU Universal BGA Reballing Stencil Platform for iPhone A8 A16 Qualcomm MTK Hisilicon CPU tin planting. XZZ L23 BGA Reballing Stencil Platform for iPhone 6 to 14 Pro Max A8 A9 A10 A12 A13 A14 A15 A16, Qualcomm, MTK, Hisilicon CPU IC soldering repair. Features: Magnetic power positioning with strong magnetic force and automatic alignment. Built in powerful magnets with strong adsorption for easy pick up and fast maintenance. Easy to operate